Manufacturers supply micro silica powder construction chemical electronic medicine special

ʻO ka micro silica, i kapa ʻia hoʻi ka silica fume a i ʻole micro silica, he huahana ia o ka hana ʻana i ka metala silika a i ʻole nā mea hao ferrosilicon. Hoʻokumu ʻia nā metala silikoni a me nā ʻāpana i loko o nā umu uila. ʻO nā mea maka he quartz, lanahu a me nā pahu lāʻau. ʻO ka uahi e loaʻa mai ka hana o ka umu ahi e hōʻiliʻili ʻia a kūʻai ʻia e like me ka silica fume, silica fume ka nui o ka amorphous (noncrystalline) silicon dioxide (SiO2), ʻO kona anawaena granule awelika he 0.15 ~ 0.20um, he 15000 ~ 20000m2 / kg, a he ikaika loa ka ʻili.

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ʻO nā mea hoʻoponopono Cementitous (Mortars & Grouts)Ka haʻahaʻa haʻahaʻa, hoʻonui i ke kūʻē ʻana mai nā chlorides, acids, nitrates a me sulfate etc2) Oil Well GroutingE hoʻonui i ka lōʻihi a me ka ikaika compressive, hoʻemi i ka permeability, ʻoi aku ka maikaʻi o ka mālama ʻana i ka leakage kinoea3) Tile Concrete, ka hale a me ka pā paia, nā panela māmā a e hoʻomaikaʻi i ka ikaika4) nā noi ʻē aʻe, e like me ka ʻoihana wai wai, nā mea hoʻonaninani wela etc.
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1.with good insulation: due to the high purity of silicon powder, low impurity content, stable performance, excellent electrical insulation performance, so that the cured material has good insulation properties and arc resistance.
2. hiki ke ho'ēmi i ka wela exothermic kiʻekiʻe o ka epoxy resin curing reaction, ho'ēmi i ka laina hoʻonui coefficient a me ka shrinkage rate o ka mea i ho'ōlaʻia, i mea e hoʻopau ai i ke kaumaha o loko o ka mea i ho'ōlaʻia a pale i ka haki.

3. pale ʻana i ka corrosion: ʻaʻole maʻalahi ka pauka silika me nā mea ʻē aʻe, a ʻo ka hapa nui o nā waikawa, ʻaʻole hiki i ka alkali ke hana kemika, ua uhi pono ʻia kona mau ʻāpana ma ka ʻili o ka mea, me ke kūpaʻa ikaika.

4.Reasonable particle grading, hiki ke hōʻemi a hoʻopau i ka ua a me ka delamination ke hoʻohana ʻia; Hiki iā ia ke hoʻonui i ka ikaika tensile a me ka compressive o ka mea i hoʻōla ʻia, hoʻomaikaʻi i ka pale ʻana i ka lole, hoʻonui i ka conductivity thermal o ka mea i hoʻōla ʻia, a hoʻonui i ka waiwai pale ahi.
5. ʻO ka pauka silicon i mālama ʻia e ka silane coupling agent he infiltration maikaʻi o nā resins like ʻole, ka hana adsorption maikaʻi, maʻalahi e hui pū, ʻaʻohe mea clumping.
6. ʻO ka pauka silicon ma ke ʻano he mea hoʻopihapiha, hoʻohui ʻia i ka resin organik, ʻaʻole wale ka hoʻomaikaʻi ʻana i ka hana o ka mea i hoʻōla ʻia, akā e hoʻemi hoʻi i ke kumukūʻai o ka huahana.
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